Micro Fabrication Lab

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Micro Fabrication Lab

The micro-fabrication lab is a class 1000 clean room that mainly provides thin film processing machines to assist the research of optoelectronic components, quantum components, sensors and micro-fluidics.

感應式耦合電漿蝕刻系統
Oxford ICP-RIE
  • Etched material：non metal
  • Gas：O2, CHF3
  • Etching pressure：1-10 mTorr
  • Minimum deposition pressure：
    200-2000mTorr
  • Plasma generation：
    Upper Electrode 15V
    Lower Electrode -15V
  • Sample Size：4" wafer
  • Usage Fee：NT$ 1000/h
電子束蒸鍍系統
Ulvac E Beam Evaporator
(for oxide)
  • Material：Oxide
  • Gas：O2
  • Minimum vacuum：~10-7 torr
  • Operating pressure：5×10-6 torr
  • Maximum pressure：3×10-5 torr
  • Heating temperature：150℃
  • Rotation rate：15 rpm
  • Sample size：4" wafer×3
    (the wafer can be diced to a minimum
    of 1×1 cm2)
  • Usage Fee：NT$ 800/h
電子束蒸鍍系統
FU-23 E Beam Evaporator
(for metal)
  • Material：Metal
    (Au, Ag, Al, Ti, Cr, Ni)
  • Minimum vacuum：~10-7 torr
  • Operating pressure：5×10-6 torr
  • Maximum pressure：3×10-5 torr
  • Heating temperature：150℃
  • Rotation rate：0-25 rpm
  • Sample size：4" wafer×3
    (the wafer can be diced to a minimum
    of 1×1 cm2)
  • Usage fee：NT$ 800/h
OEM Application
熱蒸鍍系統
Ulvac Thermal Evaporator
  • Material：metal and non metal
  • Base pressure：~10-4 Pa
  • Operating pressure：4×10-4Pa
    (3×10-6 torr)
  • Evaporation temperature：150℃
  • Srate：none
  • Sample size：4" wafer×1
    (the wafer can be diced to a minimum
    of 1×1 cm2)
  • Usage fee：NT$ 500/h
射頻/直流濺鍍系統
RF/DC Sputter
  • Material：metal and non metal
  • Source：2 DC-gun & 1 RF-gun
  • Target Size：3 inch
  • Gas：Ar, O2
  • Base pressure：~10-6 torr
  • Operating pressure：1-50 mTorr
  • Spin Rate：15 rpm
  • Sample size：4" wafer×1
    (the wafer can be diced to a minimum
    of 1×1 cm2)
  • Usage Fee：NT$ 500/h
直流濺鍍系統
TIRI DC Sputter
  • Material：metal and non metal
  • Source：1 DC-gun/ 2 DC-gun
  • Target size：2/3 inch
  • Gas：Ar
  • Base pressure：~10-6 torr
  • Operating pressure：1-50 mTorr
  • Spin rate：10-90 rpm
  • Sputtering temperature：non/700 ℃
  • Sample size：4" wafer×1
    5×5cm2 ×4
    2.5×2.5cm2 ×6
    (the wafer can be diced to a minimum
    of 1×1 cm2)
  • Usage Fee：NT$ 500/h
OEM Application
奈米壓印曝光機
Mask Aligner EVG620 NT
  • Light source：UV LED (1000W)
  • NUV：350 nm
  • Exposure Intensity：I-line 365nm /
    H-line 405nm / G-line 436nm
  • Sample size：2-6" wafer
    (the wafer can be diced to a minimum
    of 1×1 cm2)
  • Usage Fee：NT$ 1000/h
Training Video
直寫機
ML3 Mesa direct writer
  • Light source：UV LED
  • NUV：365nm / 405nm
  • Sample size：2-6" wafer
    (the wafer can be diced to a minimum of 365nm / 405nm)
  • Resolution：0.6μm / 1μm / 5μm
  • Writing speed：
    17mm2/min (0.6μm resolution)
    50mm2/min (1μm resolution)
    180mm2/min (5μm resolution)
  • Usage Fee：NT$ 800/h
Remarks
  1. Please bring your own materials. If you need to borrow materials held by our laboratory, a material fee will be charged: NT$ 10/nm.
  2. Available metal materials: Au, Ag, Al, Ti, Cr, Ni.
  3. Available oxide materials: Al2O3, SiO2, NiO.
  4. If the materials are not the above, please report to the manager first and make a note on the usage record.
Reservation

Please feel free to add comments to the paper if you have any research results produced by using the micro fabrication equipment:
This work was supported by Academia Sinica under Project No. AS-CFII-113-A10

Micro Fabrication Lab
Manager: Ms. Chia-Chu Kuo
Mail chiachuas.edu.tw
call 02-2787-3140
Manager: Dr. Shu-Yi Hsieh
Mail shuyihsiehas.edu.tw
call 02-2787-3147
Place
    Interdisciplinary Research Building of Science and Technology B2C03
Usage Application Process
  1. Passed the laboratory safety and health training course of Academia Sinica.
  2. Download and read the lab introduction and how to use it yourself.
  3. After submitting the application form, the administrator will conduct on-site safety training.
  4. Assessment will be based on the lab introduction content, usage regulations and on-site safety training content.
  5. Access control permission will be issued after passing the assessment; those who fail will have to apply for another assessment one month later.
  6. After obtaining the access control, you can apply for machine training, and then take the exam to obtain the machine use permission.
Fee
  • Training fee NT$ 1000
  • Utilization fee NT$ 2000/half year
Micro-Fabrication Lab User Committee
  • Research Center for Applied Sciences　Yi-Chung Tung, Research Fellow
  • Research Center for Applied Sciences　Shih-Yen Lin, Research Fellow
  • Institute of Chemistry　Hsiung-Lin Tu, Associate Research Fellow
  • Institute of Physics　Chung-Ting Ke, Assistant Research Fellow
  • Research Center for Critical Issues　Yen-Chun Chen, Assistant Research Specialist